Packaging techniques for microengineering devices

The development of increasingly sophisticated microengineered components, with their requirements to be smaller, more intelligent and survive in often hostile environments is placing ever greater demands on packaging technology. In practice, the viability of a number of these devices in terms of performance and cost effective production is limited by currently available materials and assembly technology. This presentation describes some of the developments taking place in the joining/processing of materials which may help to meet some of the requirements of the device designers. Two broad areas are covered: joining technology for metals and ceramics and advances in high density electronic packaging