• DocumentCode
    2884328
  • Title

    45-nm gate length CMOS technology and beyond using steep halo

  • Author

    Wakabayashi, H. ; Ueki, M. ; Narihiro, M. ; Fukai, T. ; Ikezawa, N. ; Matsuda, T. ; Yoshida, K. ; Takeuchi, K. ; Ochiai, Y. ; Mogami, T. ; Kunio, T.

  • Author_Institution
    ULSI Device Dev. Div., NEC Corp., Sagamihara, Japan
  • fYear
    2000
  • fDate
    10-13 Dec. 2000
  • Firstpage
    49
  • Lastpage
    52
  • Abstract
    45-nm CMOS devices with a steep halo using a high-ramp-rate spike annealing (HRR-SA) are demonstrated with drive currents of 697 and 292 /spl mu/A//spl mu/m for an off current less than 10 nA//spl mu/m at 1.2 V. For an off current less than 300 nA//spl mu/m, 33-nm pMOSFETs have a high drive current of 403 /spl mu/A//spl mu/m at 1.2 V. In order to fabricate a steeper halo than these MOSFETs, a source/drain extension (SDE) activation using the HRR-SA process was performed after a deep source/drain (S/D) formation. By using this sequence defined as a reverse-order S/D formation, 24-nm nMOSFETs are achieved with a high drive current of 796 /spl mu/A//spl mu/m for an off current less than 300 nA//spl mu/m at 1.2 V.
  • Keywords
    CMOS integrated circuits; MOSFET; annealing; ion implantation; large scale integration; 1.2 V; 24 to 45 nm; CMOS technology; drive current; drive currents; gate length; high-ramp-rate spike annealing; off current; pMOSFETs; reverse-order S/D formation; source/drain extension activation; steep halo; Annealing; CMOS process; CMOS technology; Dielectric films; Electrodes; Laboratories; Lithography; MOSFETs; Random access memory; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2000. IEDM '00. Technical Digest. International
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-6438-4
  • Type

    conf

  • DOI
    10.1109/IEDM.2000.904256
  • Filename
    904256