DocumentCode
2884577
Title
Practical limits of IC testers
Author
Trnka, J.
Author_Institution
IBM System Product Division, Rochester, MN, USA
Volume
XXIX
fYear
1986
fDate
19-21 Feb. 1986
Firstpage
110
Lastpage
111
Abstract
As analog and digital integrated circuits achieve higher levels of integration, testing and test time become a more serious production problem. To keep testing under control, manufacturers are relying on several methods to obtain an acceptable quality level for ICs. These include tighter process control, high temperature testing, limited pattern tests, special circuits for test, and wafer rejection criteria. The panel will provide integrated circuit producer´s viewpoints on testing to meet quality level targets, and user´s perspective on how well they are doing.
Keywords
Automatic testing; Built-in self-test; Circuit testing; Costs; Inspection; Integrated circuit testing; Manufacturing processes; System testing; Temperature sensors; Thumb;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference. Digest of Technical Papers. 1986 IEEE International
Conference_Location
Anaheim, CA, USA
Type
conf
DOI
10.1109/ISSCC.1986.1156932
Filename
1156932
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