• DocumentCode
    2884577
  • Title

    Practical limits of IC testers

  • Author

    Trnka, J.

  • Author_Institution
    IBM System Product Division, Rochester, MN, USA
  • Volume
    XXIX
  • fYear
    1986
  • fDate
    19-21 Feb. 1986
  • Firstpage
    110
  • Lastpage
    111
  • Abstract
    As analog and digital integrated circuits achieve higher levels of integration, testing and test time become a more serious production problem. To keep testing under control, manufacturers are relying on several methods to obtain an acceptable quality level for ICs. These include tighter process control, high temperature testing, limited pattern tests, special circuits for test, and wafer rejection criteria. The panel will provide integrated circuit producer´s viewpoints on testing to meet quality level targets, and user´s perspective on how well they are doing.
  • Keywords
    Automatic testing; Built-in self-test; Circuit testing; Costs; Inspection; Integrated circuit testing; Manufacturing processes; System testing; Temperature sensors; Thumb;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference. Digest of Technical Papers. 1986 IEEE International
  • Conference_Location
    Anaheim, CA, USA
  • Type

    conf

  • DOI
    10.1109/ISSCC.1986.1156932
  • Filename
    1156932