DocumentCode
2887199
Title
Test Structure on SCR Device in Waffle Layout for RF ESD Protection
Author
Ker, Ming-Dou ; Lin, Chun-Yu
Author_Institution
Nat. Chiao-Tung Univ., Hsinchu
fYear
2007
fDate
19-22 March 2007
Firstpage
196
Lastpage
199
Abstract
With the highest ESD level in a smallest layout area, SCR device was used as effective on-chip ESD protection device in CMOS technology. In this paper, a waffle layout test structure of SCR is proposed to investigate the current spreading efficiency for ESD protection. The SCR in waffle layout structure has smaller parasitic capacitance under the same ESD robustness. With smaller parasitic capacitance, the degradation on RF circuit performance due to on-chip ESD protection device can be reduced. The proposed waffle SCR is suitable for on-chip ESD protection in RF applications.
Keywords
CMOS integrated circuits; capacitance; electrostatic discharge; integrated circuit design; integrated circuit layout; integrated circuit reliability; integrated circuit testing; protection; radiofrequency integrated circuits; thyristors; CMOS technology; RF ESD protection; RF circuit performance degradation; RFIC; SCR device; current spreading efficiency; electrostatic discharges; on-chip ESD protection device; parasitic capacitance; radio-frequency integrated circuit; silicon-controlled rectifier; waffle layout test structure; CMOS technology; Circuit optimization; Circuit testing; Degradation; Electrostatic discharge; Parasitic capacitance; Protection; Radio frequency; Robustness; Thyristors; Electrostatic discharges (ESD); radio-frequency integrated circuit (RF IC); silicon-controlled rectifier (SCR);
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 2007. ICMTS '07. IEEE International Conference on
Conference_Location
Tokyo
Print_ISBN
1-4244-0781-8
Electronic_ISBN
1-4244-0781-8
Type
conf
DOI
10.1109/ICMTS.2007.374482
Filename
4252432
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