Title :
Error analysis for piezoresistive stress sensors used in flip chip packaging
Author :
Hussain, Safina ; Jaeger, Richard C. ; Suhling, Jeffrey C. ; Roberts, Jordan C. ; Motalab, Mohammad A. ; Cho, Chun-Hyung
Author_Institution :
Dept. of Mech. Eng., Auburn Univ., Auburn, AL, USA
Abstract :
Multi-element resistor rosettes on silicon are widely utilized to measure integrated circuit die stress in electronic packages and other applications. Past studies of many sources of error have led to rosette optimization and demonstrated that temperature-compensated stress extraction should be used whenever possible. In this work, we extend the error analysis to include the inherent uncertainty in the measured values of the sensor resistances and the temperature at time of the measurement. The stresses in an under-filled flip chip package are calculated using finite element simulation and utilized to evaluate the stress dependent sensitivities across the die surface. Monte Carlo simulation results confirm that temperature compensated rosette configurations should be utilized whenever possible.
Keywords :
Monte Carlo methods; chip scale packaging; error analysis; finite element analysis; flip-chip devices; integrated circuit measurement; piezoresistive devices; sensors; silicon; stress measurement; Monte Carlo simulation; electronic packages; error analysis; finite element simulation; flip chip packaging; integrated circuit die stress measurement; multielement resistor rosettes; piezoresistive stress sensors; rosette optimization; sensor resistance measurement; silicon; temperature-compensated stress extraction; Electrical resistance measurement; Electronics packaging; Error analysis; Flip chip; Integrated circuit measurements; Integrated circuit packaging; Piezoresistance; Semiconductor device measurement; Stress; Temperature sensors;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2010.5501287