Novel carbon-aluminum composites with low coefficient of thermal expansion (CTE) and high thermal conductivity

In this study, we present a newly developed carbon aluminum thermal management composite material that has a CTE less than 7.5 ppm/K, thermal conductivity over 400 W/mK, and the thermal diffusivity is 2.5 - 3 times higher than that of Cu and Al. In addition, the composite material is lightweight, and can be easily machined. We also show anisotropy in thermal performance aligning along carbon matrix extrusion direction during manufacturing. Even though this composite material is anisotropic, its thermal conductivity normal to the extrusion direction is comparable with that of Al or Al alloys. Moreover, the electrically insulating composite plates can be obtained by bonding ceramic sheets on composite surface during the composite fabrication process without the use of foreign adhesives.