• DocumentCode
    2887977
  • Title

    Modeling and simulation of lossy multi-coupled multilayer interconnect lines in solid-state digital circuits

  • Author

    Huang, Wei Xu ; Zhang, Qiu

  • Author_Institution
    Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
  • fYear
    1991
  • fDate
    16-17 Jun 1991
  • Firstpage
    970
  • Abstract
    For digital engineers designing picosecond or subnano-second rise time solid-state ICs, the authors provide a CAD tool for determining the slowed down rise time of a high speed pulse due to the skin effect loss in multi-coupled multilayer transmission lines. This field-based computation-efficient model provides an alternative to the experimental model reported recently and shows good agreement in both frequency and time domain compared with experimental results
  • Keywords
    circuit analysis computing; digital integrated circuits; digital simulation; losses; skin effect; strip lines; transmission line theory; CAD tool; field-based model; high speed pulse; lossy multicoupled lines; multilayer interconnect lines; simulation; skin effect loss; solid-state ICs; solid-state digital circuits; transmission lines; Conductors; Frequency; Integrated circuit interconnections; Microstrip; Nonhomogeneous media; Propagation losses; Skin effect; Solid modeling; Solid state circuits; Transmission line theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1991. Conference Proceedings, China., 1991 International Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CICCAS.1991.184526
  • Filename
    184526