DocumentCode
2887977
Title
Modeling and simulation of lossy multi-coupled multilayer interconnect lines in solid-state digital circuits
Author
Huang, Wei Xu ; Zhang, Qiu
Author_Institution
Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
fYear
1991
fDate
16-17 Jun 1991
Firstpage
970
Abstract
For digital engineers designing picosecond or subnano-second rise time solid-state ICs, the authors provide a CAD tool for determining the slowed down rise time of a high speed pulse due to the skin effect loss in multi-coupled multilayer transmission lines. This field-based computation-efficient model provides an alternative to the experimental model reported recently and shows good agreement in both frequency and time domain compared with experimental results
Keywords
circuit analysis computing; digital integrated circuits; digital simulation; losses; skin effect; strip lines; transmission line theory; CAD tool; field-based model; high speed pulse; lossy multicoupled lines; multilayer interconnect lines; simulation; skin effect loss; solid-state ICs; solid-state digital circuits; transmission lines; Conductors; Frequency; Integrated circuit interconnections; Microstrip; Nonhomogeneous media; Propagation losses; Skin effect; Solid modeling; Solid state circuits; Transmission line theory;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 1991. Conference Proceedings, China., 1991 International Conference on
Conference_Location
Shenzhen
Type
conf
DOI
10.1109/CICCAS.1991.184526
Filename
184526
Link To Document