DocumentCode
2889149
Title
Thermodynamic modeling and calorimetry of nanostructured materials for capacitive thermal management
Author
Baris, Oksen T. ; Tian, Hongxiang ; Sinha, Sanjiv
Author_Institution
Dept. of Mech. Sci. & Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
fYear
2010
fDate
2-5 June 2010
Firstpage
1
Lastpage
7
Abstract
Transient power dissipation profiles in handheld electronic devices alternate between high and low power states depending on usage. Capacitive thermal management based on phase change materials potentially offers a fan-less thermal management for such transient profiles. However, such capacitive management becomes feasible only if there is a significant enhancement in the enthalpy change per unit volume of the phase change material since existing bulk materials such as paraffin fall short of requirements. In this paper we propose novel nanostructured thin-film materials that can potentially exhibit significantly enhanced volumetric enthalpy change. Using fundamental thermodynamics of phase transition, we calculate the enhancement resulting from superheating in such thin film systems. We further describe the design of a microfabricated calorimeter to measure such enhancements. This work advances the state-of-art of phase change materials for capacitive cooling of handheld devices.
Keywords
calorimetry; cooling; enthalpy; phase change materials; thermal management (packaging); calorimetry; capacitive cooling; capacitive thermal management; fan-less thermal management; handheld electronic devices; nanostructured materials; nanostructured thin-film materials; phase change materials; phase transition; thermodynamic modeling; transient power dissipation; volumetric enthalpy change; Calorimetry; Cooling; Handheld computers; Nanostructured materials; Phase change materials; Power dissipation; Thermal management; Thermal management of electronics; Thermodynamics; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location
Las Vegas, NV
ISSN
1087-9870
Print_ISBN
978-1-4244-5342-9
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2010.5501367
Filename
5501367
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