• DocumentCode
    2889149
  • Title

    Thermodynamic modeling and calorimetry of nanostructured materials for capacitive thermal management

  • Author

    Baris, Oksen T. ; Tian, Hongxiang ; Sinha, Sanjiv

  • Author_Institution
    Dept. of Mech. Sci. & Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Transient power dissipation profiles in handheld electronic devices alternate between high and low power states depending on usage. Capacitive thermal management based on phase change materials potentially offers a fan-less thermal management for such transient profiles. However, such capacitive management becomes feasible only if there is a significant enhancement in the enthalpy change per unit volume of the phase change material since existing bulk materials such as paraffin fall short of requirements. In this paper we propose novel nanostructured thin-film materials that can potentially exhibit significantly enhanced volumetric enthalpy change. Using fundamental thermodynamics of phase transition, we calculate the enhancement resulting from superheating in such thin film systems. We further describe the design of a microfabricated calorimeter to measure such enhancements. This work advances the state-of-art of phase change materials for capacitive cooling of handheld devices.
  • Keywords
    calorimetry; cooling; enthalpy; phase change materials; thermal management (packaging); calorimetry; capacitive cooling; capacitive thermal management; fan-less thermal management; handheld electronic devices; nanostructured materials; nanostructured thin-film materials; phase change materials; phase transition; thermodynamic modeling; transient power dissipation; volumetric enthalpy change; Calorimetry; Cooling; Handheld computers; Nanostructured materials; Phase change materials; Power dissipation; Thermal management; Thermal management of electronics; Thermodynamics; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501367
  • Filename
    5501367