• DocumentCode
    2889658
  • Title

    Augmenting forced convection heat transfer coupled with an aerodynamic surface and a synthetic jet

  • Author

    Salapakkam, Pradeep ; Li, Ri ; Arik, Mehmet ; Gerstler, Bill

  • Author_Institution
    Gen. Electr. Global Res. Center, Niskayuna, NY, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    Forced convection heat transfer is limited with the fan flow rate or pressure drop. Therefore, it is necessary to develop novel cooling technologies that can enhance forced convection. A new heat sink design is proposed for electronics cooling applications. The objective of this study was to develop a new heat sink design, which increases heat transfer properties while containing the pressure drop. Two-dimensional CFD analysis was used to optimize the shape of the heat sink. Enhancing the heat transfer characteristics also increased the pressure drop and hence the fan power. It is observed that lower heat sink surface temperatures are highly non-linear and produce significantly larger pressure drops. A new aerodynamic heat sink shape is proposed by integrating aerodynamic flow characteristics and fan performance curves. The results show that a good compromise for higher heat transfer properties while marginally increasing the pressure drop is possible. However, we believe that further optimization of this technology will enable lower thermal resistance at the same pressure drop compared to baseline forced convection in the same flow rate.
  • Keywords
    aerodynamics; computational fluid dynamics; cooling; forced convection; heat sinks; thermal management (packaging); thermal resistance; CFD analysis; aerodynamic flow characteristic; aerodynamic heat sink shape; aerodynamic surface; cooling technology; electronics cooling; fan performance curve; forced convection heat transfer; heat sink surface temperature; pressure drop; synthetic jet; thermal resistance; Aerodynamics; Heat transfer; aerodynamic fin; airfoil fin; forced convection; heat sink;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501395
  • Filename
    5501395