Title :
Characterization of the manufacturing worthiness of semiconductor process equipment
Author :
Grewal, Gulsher ; Newberry, Stephen G. ; Toole, Dave
Author_Institution :
Intel Corp., Santa Clara, CA, USA
Abstract :
In order to achieve world-class competitive manufacturing capability, the concept of supplier partnerships was developed, with a win-win approach. Total equipment performance, which included process and manufacturing capability, strong vendor relationships, vendor contract maintenance, training, field service support, and continuous improvement methodology, was emphasized. An off-site, nonproduction facility was set up to help develop manufacturable solutions. The equipment set was exercised in the facility to simulate a volume production environment. The purpose of the exercise was to prove that the equipment can meet the intended need. Process and hardware capability of the equipment set was evaluated and documented over a large wafer volume. The result of this methodology was qualified production at high volume
Keywords :
integrated circuit manufacture; management; competitive manufacturing capability; continuous improvement methodology; equipment characterisation; equipment evaluation; field service support; hardware capability; large wafer volume; manufacturing capability; manufacturing worthiness of semiconductor process equipment; qualified production; strong vendor relationships; supplier partnerships; training; vendor contract maintenance; volume production environment; win-win approach; Continuous improvement; Etching; Manufacturing processes; Marketing and sales; Plasma applications; Plasma materials processing; Production; Pulp manufacturing; Semiconductor device manufacture; Semiconductor materials;
Conference_Titel :
Semiconductor Manufacturing Science Symposium, 1989. ISMSS 1989., IEEE/SEMI International
Conference_Location :
Burlingame, CA
DOI :
10.1109/ISMSS.1989.77248