• DocumentCode
    2890796
  • Title

    A fully integrated photolithography workcell

  • Author

    Przybyla, J. ; Hampe, M. ; Williams, J. ; Joy, T.

  • Author_Institution
    Hewlett-Packard, Corvallis, OR, USA
  • fYear
    1989
  • fDate
    22-24 May 1989
  • Firstpage
    100
  • Lastpage
    107
  • Abstract
    A photolithography workcell that allows all operations on a wafer lot, from resist coat through to inspection, to be executed by a single operator is described. The workcells are based on 5× steppers and in-line coat and develop tracks. Operation of the cell is heavily based on automation software, with a single operator-interface terminal to all subequipment and process control databases. A key benefit of the workcell is the environment in which a single operator has ownership for all aspects of the photolithographic process. Feedback on process quality is available by inspection 12 min after a lot has started. Key results from the workcell are: (1) rework rate reduced from 11% to less than 2%; (2) feedback time on a lot reduced from 8 h to 15 min; and (3) average active time of work-in-progress in the photo area reduced from 24 h to 8 h
  • Keywords
    CAD/CAM; inspection; integrated circuit manufacture; manufacturing data processing; photolithography; process computer control; quality control; semiconductor device manufacture; user interfaces; 0.8 micron; CIM system; IC manufacture; automation software; inline coat/develop tracks; inspection; photolithography workcell; process control databases; process quality feedback; resist coat; semiconductor processing; single operator-interface terminal; steppers; subequipment; submicron process capability; Automation; CMOS process; Feedback; Focusing; Inspection; Lithography; Manufacturing processes; Process control; Resists; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Science Symposium, 1989. ISMSS 1989., IEEE/SEMI International
  • Conference_Location
    Burlingame, CA
  • Type

    conf

  • DOI
    10.1109/ISMSS.1989.77255
  • Filename
    77255