DocumentCode :
2898508
Title :
Assembly Level Reliability
Author :
Mohan, Kris
Author_Institution :
Corporate Reliability Technology
fYear :
1992
fDate :
25-28 Oct. 1992
Firstpage :
69
Lastpage :
76
Keywords :
Assembly; Life estimation; Manufacturing automation; Passivation; Semiconductor device packaging; Semiconductor device reliability; Semiconductor materials; Temperature; Testing; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
Conference_Location :
Lake Tahoe, CA, USA
Type :
conf
DOI :
10.1109/IWLR.1992.657986
Filename :
657986
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2898508
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