Title :
Small signal electrical testing in package engineering
Author_Institution :
Worldwide Manufacturing, National Semiconductor, USA
fDate :
Nov. 30 2010-Dec. 2 2010
Abstract :
The keynote speaker will provide an insight into today IC test systems and test handlers and their challenges and selection. The key test blocks (functional test or parametric) and key test functions will be examined and illustrated. Interesting case studies on test program and control and limitation for packaging qualification will be discussed in detail including some tips to meet future packaging test challenges.
Keywords :
integrated circuit packaging; integrated circuit testing; IC test systems; key test blocks; key test functions; package engineering; packaging qualification; packaging test; small signal electrical testing; test handlers; Engineering profession;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
Conference_Location :
Melaka
Print_ISBN :
978-1-4244-8825-4
DOI :
10.1109/IEMT.2010.5746762
