Title :
Experimental and Numerical Simulation Study on Uniformity of Temperature and Flow Field in an Advanced Packaging Electroplating Cell
Author :
Zhu, Dongsheng ; Wang, Changhong ; Zhou, Xuan ; Tu, Shandong
Author_Institution :
South China Univ. of Technol., Guangzhou
Abstract :
An experimental facility of advanced packaging electroplating cell is developed to study the uniformity of the temperature and flow field in the high precision electroplating cell. Based on heat transfer and computational fluid dynamics, a 2D numerical model is founded to analyze the temperature field and flow field of the experimental electroplating cell enclosure. Combing with test and simulated results, the effects of the heat source intensity, ventilated mode and heat transfer coefficient on the thermal field of the cell are discussed. Under the condition of natural convection with temperature gradient driving, although heat/cold source intensity and ventilated mode both have effects on the temperature field and flow field of the electroplating enclosure, the heat/cold source is the more marked factor influencing the uniformity of temperature field and flow field. The experimental and simulated results can give a way to enhance the uniformity of the temperature field and flow field and to improve the quantity of the WL-CSP electroplating.
Keywords :
chip scale packaging; computational fluid dynamics; convection; electroplating; thermal analysis; thermal management (packaging); wafer level packaging; WL-CSP electroplating; advanced packaging electroplating cell; cold source intensity; computational fluid dynamics; electroplating cell enclosure flow field; flow field uniformity; heat source intensity; heat transfer coefficient; high precision electroplating cell; natural convection condition; numerical simulation model; temperature field; temperature field uniformity; temperature gradients driving; ventilated mode; wafer-level chip-scale packaging; Cooling; Educational technology; Electronic packaging thermal management; Fluid flow control; Heat sinks; Heat transfer; Numerical simulation; Packaging machines; Temperature control; Testing;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441374
