3-D Large-Scale IC/MEMS Co-Integration Using Liquid Solder for Flip-Chip Assembly

Author

Chapuis, Y.A. ; Debray, A. ; Fujita, H.

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

5

Abstract

In this paper, we discuss a flip-chip packaging method using liquid solder for 3D large-scale electronic/MEMS co-integration. This approach has been inspired from self-assembly technique which is emerging as one of the main methods for fabrication of heterogeneous micro-and nano-systems. We proposed to form solder bump by coating liquid solder directly on electrodes of a MEMS chip based on sophisticate microstructures of electrostatic microactuator array. Self-alignment and assembly techniques for electronic receptor chip were also detailed in order to achieve efficient flip-chip of MEMS and Electronic chip without any stiction and contamination problem. Functionality of the system has been validated and perspectives discussed.

Keywords

chip scale packaging; flip-chip devices; large scale integration; microactuators; micromechanical devices; nanotechnology; self-assembly; solders; surface contamination; 3-D large-scale electronic-MEMS co-integration; MEMS chip; contamination problem; electrodes; electronic chip; electrostatic microactuator array; flip-chip assembly; flip-chip packaging method; heterogeneous microsystem fabrication; heterogeneous nanosystem fabrication; liquid solder coating; self-alignment technique; self-assembly technique; solder bump; Assembly; Coatings; Electrodes; Electronics packaging; Electrostatics; Fabrication; Large-scale systems; Micromechanical devices; Microstructure; Self-assembly;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441382

Filename

4441382