Title :
Influence of PCB Vibration Modal on Peeling Stress of Solder Joints in Board-level Package Under Drop Impact
Author :
Jie, Bai ; Fei, Qin ; Tong, An ; Chen, Na
Author_Institution :
Beijing Univ. of Technol., Beijing
Abstract :
In this paper, a very detailed finite element model of PCB board and BGA package was constructed. A dynamic drop/impact simulation of the board-level package was conducted by LS-DYNA and Input-G approach under the drop Condition H recommended by JEDEC standard JESD22-B111. A PCB deflection equivalent static analysis was conducted also in order to investigate the difference of peeling stress between the dynamic and the static model.
Keywords :
ball grid arrays; integrated circuit packaging; integrated circuit reliability; printed circuits; solders; stress analysis; BGA package; Input-G approach; JEDEC standard; JESD22-B111 standard; LS-DYNA; PCB board level packages; PCB deflection equivalent static analysis; PCB vibration modal; drop-impact loadings; drop-impact simulation; oversafe design; packages reliability; solder joints; static peeling stress analysis; Computational modeling; Computer simulation; Electronics packaging; Finite element methods; Mechanical engineering; Numerical simulation; Soldering; Stress; Transient analysis; Vibrations;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441409
