DocumentCode :
2903830
Title :
Design of Solder Joint for Self-Alignment in Optical Fiber Attachment Soldering
Author :
Zhang, Wei ; Wang, Chunqing ; Tian, Yanhong
Author_Institution :
Harbin Inst. of Technol., Harbin
fYear :
2007
fDate :
14-17 Aug. 2007
Firstpage :
1
Lastpage :
5
Abstract :
The self-alignment motion of optical fiber is critical to the low-cost and high-precision direct-coupling technology in optoelectronic packaging. In this research, the self-alignment method by using surface tension of molten solder and by adopting specific pad shape was proposed. First, the self-alignment model of solder joint in fiber attachment soldering was developed by using the public domain software called Surface Evolver and the three-dimensional (3D) geometry of solder joint with different pad shape was analyzed. Then, the self-alignment behavior of solder joint with an initial yaw misalignment was discussed and the theoretical equilibrium positions of five different pad shapes were calculated. Next, experiments were done to examine the theoretical equilibrium positions of these pads. The numerical results show that the theoretical equilibrium positions of ellipse pad are the major axis of ellipse, and it is much more appropriate for self-alignment. And the diamond pad and the combined pad have also self-alignment effects, but the square and the crisscross pad are not appropriate for self-alignment due to more than two equilibrium positions. The experimental results show the solder joint with initial yaw angle can be self-aligned to the theoretical equilibrium position of these five pads and solder joint of ellipse pad demonstrates smaller alignment error than that of diamond and combined pads.
Keywords :
electronics packaging; integrated optoelectronics; optical fibre fabrication; public domain software; soldering; surface tension; Surface Evolver; high-precision direct-coupling technology; optical fiber attachment soldering; optoelectronic packaging; public domain software; self-alignment motion; solder joint design; surface tension; three-dimensional geometry; yaw misalignment; Costs; Electronics packaging; Materials science and technology; Mathematical model; Optical design; Optical fiber devices; Optical fibers; Shape; Soldering; Surface tension;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
Type :
conf
DOI :
10.1109/ICEPT.2007.4441441
Filename :
4441441
Link To Document :
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