Title :
Effect of Dopant on Microstructure and Mechanical Properties of Pb-Free Solder Joints
Author_Institution :
South China Univ. of Technol., Guangzhou
Abstract :
The effect of Sb addition on IMC growth in Sn-3.5 Ag-0.7 Cu solder joints has been studied in this work. IMC morphologies of Sn-3.8 Ag-0.7 Cu solder joints have been changed as a result of the Sb addition. The IMC layer becomes thinner with the increase in Sb proportion. It is observed that the fine particles precipitating increase in IMC layer with the increase in Sb proportion during reflow. Sb addition can increase the activation energy of Sn-3.8 Ag-0.7 Cu solder alloy system, and reduce the atomic diffusion rate, so as to inhibit the excessive growth of the IMC. It is found that the solder alloy with about 0.8 wt% Sb has the highest activation energy and lowest interdiffusion coefficient for the formation of the IMCs. The tensile strength can be slightly improved by Sb addition and is significantly affected by the IMC formation in solder joints.
Keywords :
antimony; copper alloys; precipitation; reflow soldering; silver alloys; solders; tensile strength; tin alloys; IMC growth; SnAgCu; activation energy; atomic diffusion rate; dopant effect; interdiffusion coefficient; intermetallic compound layer; mechanical properties; solder joints microstructure; tensile strength; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Mechanical factors; Microstructure; Morphology; Ovens; Scanning electron microscopy; Soldering; Tin alloys;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441449
