Title :
Synthesis and Characterization of Novel Multiaromatic Epoxy Resin for Advanced Microelectronic Packaging Applications
Author :
Tao, Zhiqiang ; Ding, Jiapei ; Yang, Haixia ; Fan, Lin ; Yang, Shiyong
Author_Institution :
Chinese Acad. of Sci., Beijing
Abstract :
The novel multiaromatic epoxy resin and hardener was synthesized and characterized. The mechanical, thermal, electrical as well as flame retardant properties of cured epoxy resins were systematically investigated. Experiment results indicated that the cured novel multiaromatic resins exhibited very good mechanical properties, good electrical properties, high glass transition temperature, good dielectric properties, low moisture absorption and very good flame retardancy.
Keywords :
dielectric properties; integrated circuit packaging; polymers; advanced microelectronic packaging applications; cured epoxy resins; dielectric properties; electrical properties; flame retardancy; flame retardant properties; glass transition temperature; mechanical properties; moisture absorption; multiaromatic epoxy resin; thermal properties; Absorption; Dielectrics; Epoxy resins; Flame retardants; Glass; Mechanical factors; Microelectronics; Moisture; Packaging; Temperature;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441455
