DocumentCode :
2904570
Title :
Effects of moisture on radiation-induced degradation in CMOS SOI transistors
Author :
Shaneyfelt, Marty R. ; Schwank, James R. ; Dodd, Paul E. ; Hill, Tom A. ; Dalton, Scott M. ; Swanson, Scot E.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
fYear :
2009
fDate :
14-18 Sept. 2009
Firstpage :
20
Lastpage :
23
Abstract :
The effects of moisture on radiation-induced charge buildup in the oxides of a 0.35 μm SOI technology are explored. Data show no observable effects of moisture-related aging on radiation hardness. These results are in contrast to those of previous work performed on bulk MOS technologies fabricated in the 1980s. The cause of these differences do not appear to be due to differences in final chip passivation layers. Instead, other processing variables (including the use of different implant materials and thicker overlayers) may account for these differences. In any case, the SOI technology results indicate that not all advanced technologies exposed to moisture are necessarily susceptible to significant long-term radiation-induced aging effects.
Keywords :
CMOS integrated circuits; moisture; passivation; radiation hardening (electronics); silicon-on-insulator; transistors; CMOS SOI transistor; MOS radiation effect; SOI technology; bulk MOS technology; chip passivation layer; implant material; long-term radiation-induced aging effect; moisture; radiation hardness; radiation-induced charge buildup; radiation-induced degradation; size 0.35 mum; Aging; Logic gates; Moisture; Passivation; Radiation effects; Silicon; Transistors; MOS radiation effects; aging effects; hydrogen exposure; ionizing radiation; moisture exposure; silicon-on-insulator;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radiation and Its Effects on Components and Systems (RADECS), 2009 European Conference on
Conference_Location :
Bruges
ISSN :
0379-6566
Print_ISBN :
978-1-4577-0492-5
Electronic_ISBN :
0379-6566
Type :
conf
DOI :
10.1109/RADECS.2009.5994546
Filename :
5994546
Link To Document :
بازگشت