DocumentCode
2904697
Title
Direct Chip Attachment (DCA) Packaging of a 2-D Thermal Flow Sensor
Author
Shen, Guangping ; Wu, Jian ; Zhang, Hua ; Qin, Ming ; Huang, Qing An
Author_Institution
Southeast Univ., Nanjing
fYear
2007
fDate
14-17 Aug. 2007
Firstpage
1
Lastpage
3
Abstract
The design and fabrication of a DCA packaged thermal flow sensor, as well as the simulation and test results were presented in this paper. The fabricated flow sensor was glued to the backside of PCB board with the adhesive, and wire bonded to front side of the PCB through a prefabricated hole, and then the chip was capsulated using thermal insulated resin on the front side. The test results matched well with the predicted value, with an error no more than 8%.
Keywords
flow sensors; integrated circuit packaging; printed circuits; resins; thermal insulation; 2-D thermal flow sensor; DCA packaging; PCB board; direct chip attachment; printed circuit board; thermal insulated resin; Bonding; Ceramics; Detectors; Fabrication; Packaging; Resins; Temperature sensors; Thermal conductivity; Thermal sensors; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1392-8
Electronic_ISBN
978-1-4244-1392-8
Type
conf
DOI
10.1109/ICEPT.2007.4441487
Filename
4441487
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