• DocumentCode
    2904697
  • Title

    Direct Chip Attachment (DCA) Packaging of a 2-D Thermal Flow Sensor

  • Author

    Shen, Guangping ; Wu, Jian ; Zhang, Hua ; Qin, Ming ; Huang, Qing An

  • Author_Institution
    Southeast Univ., Nanjing
  • fYear
    2007
  • fDate
    14-17 Aug. 2007
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The design and fabrication of a DCA packaged thermal flow sensor, as well as the simulation and test results were presented in this paper. The fabricated flow sensor was glued to the backside of PCB board with the adhesive, and wire bonded to front side of the PCB through a prefabricated hole, and then the chip was capsulated using thermal insulated resin on the front side. The test results matched well with the predicted value, with an error no more than 8%.
  • Keywords
    flow sensors; integrated circuit packaging; printed circuits; resins; thermal insulation; 2-D thermal flow sensor; DCA packaging; PCB board; direct chip attachment; printed circuit board; thermal insulated resin; Bonding; Ceramics; Detectors; Fabrication; Packaging; Resins; Temperature sensors; Thermal conductivity; Thermal sensors; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1392-8
  • Electronic_ISBN
    978-1-4244-1392-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2007.4441487
  • Filename
    4441487