DocumentCode
2904949
Title
Design of miniaturized RF SAW duplexer package
Author
Hao Dong ; Wu, Thomas X.
Author_Institution
Central Florida Univ., Orlando, FL, USA
Volume
2
fYear
2003
fDate
5-8 Oct. 2003
Firstpage
1157
Abstract
This paper provides a comprehensive methodology for accurate analysis and design of miniaturized RF SAW duplexer package. Full-wave analysis is applied to get the package model. Die and bonding wire modeling is also discussed. After that, improvement of the isolation is investigated. Simulation and measurement results are compared and excellent agreement is found. The technique developed in this paper reduces the design cycle time significantly and can be applied to various RF SAW device packages.
Keywords
integrated circuit bonding; integrated circuit design; integrated circuit packaging; isolation technology; radiofrequency integrated circuits; surface acoustic wave devices; RF SAW device packages; RF SAW duplexer package; bonding wire modeling; die modeling; full-wave analysis; isolation improvement; package model; Bonding; Electronics packaging; Filters; Radio frequency; Radio transmitters; Receivers; Receiving antennas; Surface acoustic wave devices; Surface acoustic waves; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN
0-7803-7922-5
Type
conf
DOI
10.1109/ULTSYM.2003.1293106
Filename
1293106
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