Mechanism and Fracturing Modes of Solder Joints Subjected to High-speed Shearing Forces

We develop a novel numerical simulation methodology by using LS-DYNA combining with erosion/interface fracturing elements and mass-scaled scheme in tins paper to research on transient structural responses of a single package-level solder joint subjected to high-speed (>100 mm/s) ball shear load. The proposed simulation procedure is benchmarked by comparing with experimental data obtained by using INSTRON Microimpact tester. After the numerical model is validated, transition conditions between IMC fracturing and bulk solder fracturing modes as well as relation between impact force and joint adhesion of interfaces are identified numerically therefore.