DocumentCode :
2905095
Title :
Application of Robust Design on the Optimal Process Design of Thermo-mechanical Reliability of PBGA Solder Joint
Author :
Xiao, Xiaoqing ; Zhou, Jicheng ; En, Yunfei ; Chen, Ni
Author_Institution :
Central South Univ., Changsha
fYear :
2007
fDate :
14-17 Aug. 2007
Firstpage :
1
Lastpage :
5
Abstract :
Based on robust design (Taguchi method) and finite element method (FEM). the thermo-mechanical reliability of plastic ball grid array (PBGA) solder joint subject to an accelerated thermal cycling test condition is studied. Including PCB size, substrate thickness, die coefficient of thermal expansion (CTE). and solder joint CTE et al. 8 different control factors are considered for a robust design towards enhancement of the thermal fatigue resistance of solder joint by using a mixed-level orthogonal array. From the results, importance of these factors on the thermo-mechanical reliability of PBGA solder joint is ranked. The best parameter combination is A1B2C3D1E2F1G3H1 in which the substrate CTE. solder joint CTE. the thickness of substrate, die CTE are the most important. The optimal design, after the comparative experiment with ANN (artificial neural network) and conformation experiment, has remarkable enhancement in thermo-mechanical reliability compared with the original design.
Keywords :
Taguchi methods; ball grid arrays; electronic engineering computing; finite element analysis; neural nets; plastic packaging; printed circuit design; reliability; soldering; thermal expansion; thermal resistance; thermal stress cracking; ANN; FEM; PBGA solder joint; PCB; Taguchi method; accelerated thermal cycling test; artificial neural network; die coefficient of thermal expansion; finite element method; mixed-level orthogonal array; optimal process design; plastic ball grid array; thermal fatigue resistance; thermo-mechanical reliability; Artificial neural networks; Design methodology; Electronics packaging; Finite element methods; Plastics; Process design; Robustness; Soldering; Thermal resistance; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
Type :
conf
DOI :
10.1109/ICEPT.2007.4441508
Filename :
4441508
Link To Document :
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