• DocumentCode
    2905331
  • Title

    Efficient single event upset simulations of a tolerant PD SOI CMOS D Flip-Flop

  • Author

    Alvarado, J. ; Kilchytska, V. ; Berger, G. ; Flandre, D.

  • Author_Institution
    Microelectron. Lab., Univ. Catholique de Louvain, Louvain-la-Neuve, Belgium
  • fYear
    2009
  • fDate
    14-18 Sept. 2009
  • Firstpage
    225
  • Lastpage
    229
  • Abstract
    A simple way for modeling the single event upset (SEU) in Partially Depleted (PD) SOI CMOS circuits by Spice simulations is presented. A Verilog-A module connected to the body contact of PD SOI MOSFET is implemented to describe the transient current generated by an ion-track crossing the transistor. Verilog-A module is given by a physical based compact model and hence accounts for all variations in MOSFET´s physical parameters (i.e. mobility, lifetime, etc.) caused by irradiation, temperature, bias conditions, etc. Good agreement with mixed-mode numerical simulations is observed at different conditions. Both kinds of simulations show that PD SOI CMOS D Flip-Flop is tolerant to high LET energies, whereas bias supply reduction as well as an increase in the clock frequency of the flip-flop can degrade this tolerance.
  • Keywords
    CMOS logic circuits; SPICE; circuit simulation; flip-flops; hardware description languages; silicon-on-insulator; LET energy; MOSFET physical parameter; Si; Spice simulation; Verilog-A module; clock frequency; ion-track crossing; mixed mode numerical simulation; partially depleted SOI CMOS circuit; single event upset simulation; tolerant PD SOI CMOS D flip-flop; transient current generation; CMOS integrated circuits; Clocks; Flip-flops; Hardware design languages; Semiconductor device modeling; Single event upset; Transient analysis; Circuit and device simulation; heavy ion irradiation; silicon on insulator; single event upset;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radiation and Its Effects on Components and Systems (RADECS), 2009 European Conference on
  • Conference_Location
    Bruges
  • ISSN
    0379-6566
  • Print_ISBN
    978-1-4577-0492-5
  • Electronic_ISBN
    0379-6566
  • Type

    conf

  • DOI
    10.1109/RADECS.2009.5994584
  • Filename
    5994584