Fabrication of multi-functional integrated liquid sensors using MEMS and film-bonding technology

Author

Kaneshiro, C. ; Koh, K. ; Hohkawa, K. ; Yamamura, A. ; Matsumoto, K.

Author_Institution

Dept. of Electr. & Electr. Eng., Kanagawa Inst. of Technol., Atsugi, Japan

Volume

2

fYear

2003

fDate

5-8 Oct. 2003

Firstpage

1330

Abstract

In this paper, we present the results of a basic study on fabrication technology of integrated sensors circuit, in which the various sensors based on the mass loading effect, a conductive change, and photo-luminescence methods are integrated on piezoelectric substrate. We propose a design of micro-pump with a simple structure for low cost. Also, the experimental result shows that its controllability of liquid flux is very high sensitive. Moreover, we adopt Au-IDT electrodes with immobilized oxidases for sensing glucose concentration.

Keywords

chemical sensors; integrated circuit bonding; integrated circuit design; micromechanical devices; micropumps; sugar; Au-IDT electrodes; MEMS; conductive change; fabrication technology; film-bonding technology; glucose concentration sensing; immobilized oxidases; integrated sensors circuit; liquid flux controllability; mass loading effect; micropump; multifunctional integrated liquid sensors; photoluminescence methods; piezoelectric substrate; Bonding; Chemical technology; Electrodes; Fabrication; Magnetic materials; Micromechanical devices; Micropumps; Piezoelectric materials; Semiconductor materials; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics, 2003 IEEE Symposium on

Print_ISBN

0-7803-7922-5

Type

conf

DOI

10.1109/ULTSYM.2003.1293148

Filename

1293148