DocumentCode :
2906154
Title :
Electronics Packaging Technologies for Automotive Electronics
Author :
Sham, Ivan M L ; Chen, Zhong
Author_Institution :
Hong Kong Applied Science & Technology Research Institute (ASTRI), China
fYear :
2007
fDate :
14-17 Aug. 2007
Firstpage :
1
Lastpage :
1
Keywords :
Automotive electronics; Automotive engineering; Electronic equipment testing; Electronics packaging; Intelligent vehicles; Joining materials; Materials reliability; Materials science and technology; Soldering; Standards development;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
Type :
conf
DOI :
10.1109/ICEPT.2007.4441576
Filename :
4441576
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2906154
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