DocumentCode
2907102
Title
Simulation-Based Performance Analysis and Tuning for a Two-Level Directly Connected System
Author
Totoni, Ehsan ; Bhatele, Abhinav ; Bohm, Eric J. ; Jain, Nikhil ; Mendes, Celso L. ; Mokos, Ryan M. ; Zheng, Gengbin ; Kale, Laxmikant V.
Author_Institution
Dept. of Comput. Sci., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
fYear
2011
fDate
7-9 Dec. 2011
Firstpage
340
Lastpage
347
Abstract
Hardware and software co-design is becoming increasingly important due to complexities in supercomputing architectures. Simulating applications before there is access to the real hardware can assist machine architects in making better design decisions that can optimize application performance. At the same time, the application and runtime can be optimized and tuned beforehand. BigSim is a simulation-based performance prediction framework designed for these purposes. It can be used to perform packet-level network simulations of parallel applications using existing parallel machines. In this paper, we demonstrate the utility of BigSim in analyzing and optimizing parallel application performance for future systems based on the PERCS network. We present simulation studies using benchmarks and real applications expected to run on future supercomputers. Future petascale systems will have more than 100,000 cores, and we present simulations at that scale.
Keywords
digital simulation; hardware-software codesign; parallel machines; performance evaluation; BigSim; hardware and software codesign; machine architecture; packet level network simulations; parallel applications; parallel machines; simulation based performance analysis; simulation based performance tuning; supercomputing architectures; two level directly connected system; Network topology; Noise; Routing; Supercomputers; Three dimensional displays; Topology; Tuning; collective communication; mapping; performance prediction; simulation; system noise;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel and Distributed Systems (ICPADS), 2011 IEEE 17th International Conference on
Conference_Location
Tainan
ISSN
1521-9097
Print_ISBN
978-1-4577-1875-5
Type
conf
DOI
10.1109/ICPADS.2011.121
Filename
6121296
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