DocumentCode
2907667
Title
Proposal of buried metal heterojunction bipolar transistor and fabrication of HBT with buried tungsten
Author
Arai, T. ; Tobita, H. ; Harada, Y. ; Suhara, M. ; Miyamoto, Y. ; Furuya, K.
Author_Institution
Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Japan
fYear
1999
fDate
1999
Firstpage
183
Lastpage
186
Abstract
We propose a buried metal heterojunction bipolar transistor (BM-HBT), in which buried metal in the collector layer could reduce the total base-collector capacitance. To show the possibility of making a BM-HBT, we fabricated an InP-based HBT with buried tungsten mesh replacing the subcollector layer, where tungsten mesh works as a Schottky collector electrode. A flat heterostructure on the InP collector layer of the buried tungsten mesh was confirmed by a cross-sectional SEM view. A DC current gain of 12 was measured from the common-emitter collector I-V characteristics
Keywords
III-V semiconductors; Schottky barriers; buried layers; heterojunction bipolar transistors; indium compounds; microwave bipolar transistors; semiconductor device measurement; tungsten; DC current gain; HBT; InP-W; InP-based HBT; Schottky collector electrode; buried metal heterojunction bipolar transistor; buried tungsten; buried tungsten mesh; collector layer; common-emitter collector I-V characteristics; cross-sectional SEM; fabrication; flat heterostructure; microwave performance; total base-collector capacitance; Capacitance; Current measurement; Electrodes; Epitaxial growth; Fabrication; Gain measurement; Heterojunction bipolar transistors; Indium phosphide; Proposals; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials, 1999. IPRM. 1999 Eleventh International Conference on
Conference_Location
Davos
ISSN
1092-8669
Print_ISBN
0-7803-5562-8
Type
conf
DOI
10.1109/ICIPRM.1999.773664
Filename
773664
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