• DocumentCode
    2909236
  • Title

    Recent trends in bulk acoustic wave resonator sensors

  • Author

    Hauptmann, Peter ; Lucklum, Ralf ; Schröder, Jens

  • Author_Institution
    Inst. for Micro-& Sensor Syst., Magdeburg Univ., Germany
  • Volume
    1
  • fYear
    2003
  • fDate
    5-8 Oct. 2003
  • Firstpage
    56
  • Abstract
    Devices based on piezoelectric materials, which allow transduction between electrical and acoustic energies, have been developed in a number of configurations for sensor applications and materials characterization. Bulk acoustic wave resonators like QCM and ultrasonic sensors can be classified in the category of acoustic wave resonators sensors. The latter will not be considered here. In the following the state-of-the-art of bulk acoustic wave resonator sensors will be discussed. Models for the description of the transduction mechanisms of acoustic-wave based chemical or biochemical sensors are introduced and compared to derive the application chance and limitations of these sensors. The importance of suitable sensor interface electronics for getting exact sensor data in damping fluid systems will be shown. In this context the signal-to-noise-ratio (SNR) plays a dominant role. Selected application examples are given. Aspects of future trends are discussed.
  • Keywords
    bulk acoustic wave devices; crystal resonators; microbalances; multilayers; piezoelectric materials; piezoelectric transducers; quartz; surface acoustic wave resonators; surface acoustic wave sensors; surface acoustic wave transducers; SiO2; acoustic energies; acoustic wave resonator sensors; biochemical sensors; chemical sensors; damping fluid systems; electrical energies; microbalances; multilayers; piezoelectric materials; sensor interface electronics; signal-noise ratio; transduction; Acoustic applications; Acoustic devices; Acoustic materials; Acoustic sensors; Acoustic waves; Biosensors; Chemical and biological sensors; Piezoelectric materials; Sensor phenomena and characterization; Sensor systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293356
  • Filename
    1293356