DocumentCode :
2909317
Title :
Testing of MEMS material properties and stability
Author :
Brown, Stuart B. ; Muhlstein, Christopher ; Chui, Clarence ; Abnet, Catneron
Author_Institution :
Xponent Ailure Anal. Associates, Natick, MA, USA
fYear :
1998
fDate :
24-27 Aug 1998
Firstpage :
161
Lastpage :
162
Abstract :
This article presents progress in characterizing MEMS failure. The results are applicable to a wide range of materials and applications. Data is presented, however, for MEMS polysilicon and single crystal silicon. The observations of fatigue crack growth in single crystal silicon and time dependent crack initiation in polysilicon are important because they indicate MEMS failure modes that have not been previously recognized. The effects of microstructure, environment, and fabrication can become significant on the micro scale even when they are irrelevant in larger, macroscale structures. The microstructure of MEMS devices is also different from that of large bodies of the same material
Keywords :
crack detection; elemental semiconductors; failure (mechanical); fault diagnosis; materials testing; micromechanical devices; silicon; MEMS failure modes; MEMS material properties; Si; fatigue crack growth; macroscale structures; microstructure; polysilicon; single crystal silico; stability; testing; time dependent crack initiation; Crystal microstructure; Crystalline materials; Fabrication; Fatigue; Material properties; Materials testing; Microelectromechanical devices; Micromechanical devices; Silicon; Stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
AUTOTESTCON '98. IEEE Systems Readiness Technology Conference., 1998 IEEE
Conference_Location :
Salt Lake City, UT
ISSN :
1088-7725
Print_ISBN :
0-7803-4420-0
Type :
conf
DOI :
10.1109/AUTEST.1998.713437
Filename :
713437
Link To Document :
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