• DocumentCode
    2909462
  • Title

    Design guideline for resistive termination of on-chip high-speed interconnects

  • Author

    Tsuchiya, Akira ; Hashimoto, Masanori ; Onodera, Hidetoshi

  • Author_Institution
    Kyoto Univ.
  • fYear
    2005
  • fDate
    21-21 Sept. 2005
  • Firstpage
    613
  • Lastpage
    616
  • Abstract
    This paper discusses the resistive termination of on-chip high-performance interconnects. Resistive termination can improve the bandwidth of on-chip interconnects, on the other hands, increases the power dissipation. Therefore a design guideline for resistive termination is necessary. In this paper, we propose a method to determine the termination of on-chip interconnects. The termination derived by the proposed method provides minimum sensitivity to process variation as well as maximum eye-opening in voltage
  • Keywords
    integrated circuit design; integrated circuit interconnections; high-performance interconnects; high-speed interconnects; on-chip interconnects; power dissipation; process variation; resistive termination; Bandwidth; Bit rate; Electrical capacitance tomography; Guidelines; Impedance; Performance analysis; Power dissipation; Reflection; Transmission lines; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-9023-7
  • Type

    conf

  • DOI
    10.1109/CICC.2005.1568742
  • Filename
    1568742