DocumentCode
2909462
Title
Design guideline for resistive termination of on-chip high-speed interconnects
Author
Tsuchiya, Akira ; Hashimoto, Masanori ; Onodera, Hidetoshi
Author_Institution
Kyoto Univ.
fYear
2005
fDate
21-21 Sept. 2005
Firstpage
613
Lastpage
616
Abstract
This paper discusses the resistive termination of on-chip high-performance interconnects. Resistive termination can improve the bandwidth of on-chip interconnects, on the other hands, increases the power dissipation. Therefore a design guideline for resistive termination is necessary. In this paper, we propose a method to determine the termination of on-chip interconnects. The termination derived by the proposed method provides minimum sensitivity to process variation as well as maximum eye-opening in voltage
Keywords
integrated circuit design; integrated circuit interconnections; high-performance interconnects; high-speed interconnects; on-chip interconnects; power dissipation; process variation; resistive termination; Bandwidth; Bit rate; Electrical capacitance tomography; Guidelines; Impedance; Performance analysis; Power dissipation; Reflection; Transmission lines; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9023-7
Type
conf
DOI
10.1109/CICC.2005.1568742
Filename
1568742
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