Title :
Fully sampled matrix transducer for real time 3D ultrasonic imaging
Author :
Savord, Bernard ; Solomon, Rod
Author_Institution :
Philips Med. Syst., Andover, MA, USA
Abstract :
A 2D array for acquiring 3D images is described. Interconnection methods are presented that connect elements of the array to integrated circuits (ICs) within the transducer. These ICs simultaneously process signals from ALL elements forming a fully sampled array. Comparisons are made with mechanical and sparse array solutions. Several signal processing options for use within the ICs are presented.
Keywords :
acoustic signal processing; integrated circuit interconnections; ultrasonic imaging; ultrasonic transducer arrays; 3D ultrasonic imaging; ICs; integrated circuits; interconnection methods; sampled matrix transducer; signal processing; Acoustic arrays; Application specific integrated circuits; Conductors; Etching; Integrated circuit interconnections; Magnetic heads; Piezoelectric transducers; Ultrasonic imaging; Ultrasonic transducers; Wire;
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
DOI :
10.1109/ULTSYM.2003.1293556
