Title :
Three-dimensional analysis of an enhanced cooling system for electronic packaging
Author :
Wong, C.W. ; Seetharamu, K.N. ; Alimuddin, Zainal ; Hassan, A.Y. ; Goh, Teck Joo
Author_Institution :
Sch. of Mech. Eng., Malaysia Sci. Univ., Tronoh, Malaysia
Abstract :
This study investigates the maximum heat flux and its corresponding superheat temperature for a straight pin fin in a boiling FC-72. Investigations are carried out numerically under atmospheric pressure by solving a three dimensional heat conduction equation in steady state. The finite element method (FEM) is used to investigate this phenomenon. The numerical results are in good agreement with available experimental results. One-dimensional analysis of boiling on a straight pin fin had been carried out. Therefore, comparison is made between the one and three-dimensional analysis results. The effect of length and diameter on the maximum heat flux (MHF) and the operational stability are also investigated
Keywords :
cooling; finite element analysis; heat conduction; thermal management (packaging); thermal stability; 3D analysis; 3D heat conduction equation; atmospheric pressure; boiling 1D analysis; boiling FC-72; diameter effects; electronic packaging; enhanced cooling system; finite element method; length effects; maximum heat flux; operational stability; straight pin fin; superheat temperature; Assembly; Electronic components; Electronics cooling; Electronics packaging; Equations; Finite element methods; Mechanical engineering; Stability analysis; Tellurium; Tin;
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
DOI :
10.1109/EPTC.2000.906412
