• DocumentCode
    2914366
  • Title

    Micromachined Faraday cup array using deep reactive ion etching

  • Author

    Darling, R.B. ; Scheidemann, A.A. ; Bhat, K.N. ; Tai-Chang Chen

  • Author_Institution
    Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
  • fYear
    2001
  • fDate
    25-25 Jan. 2001
  • Firstpage
    90
  • Lastpage
    93
  • Abstract
    A micromachined Faraday cup array (MFCA) for position sensitive ion detection has been developed using a deep reactive ion etching (DRIE) process. Linear, closely spaced arrays of 64, 128, and 256 cups have been produced with pitches of 250 /spl mu/m and 150 /spl mu/m. Low leakage MOS capacitors formed into DRIE trenches form effective ion collection traps with stable and electrostatically isolated capacitances. These closely spaced arrays of Faraday cups enable a new generation of compact mass spectrometers with true multi-channel detection capability. Since all of the incident ion flux is continuously intercepted by the array, no ion flux is lost as in scanning systems, and the overall sensitivity of the mass spectrometer is drastically improved by a factor approximately equal to the number of cups in the array. The MFCA is thus an ideal component for miniaturized mass spectrometers, ion beam profiling, and chemical analyzers which must work with very small sample volumes or high throughputs.
  • Keywords
    MOS capacitors; mass spectrometer accessories; micromachining; particle traps; position sensitive particle detectors; sputter etching; MOS capacitor; chemical analysis; deep reactive ion etching; electrostatic isolation; ion beam profiling; ion trap; mass spectrometer; micromachined Faraday cup array; multi-channel detection; position sensitive ion detector; Chemical analysis; Coaxial components; Dynamic range; Etching; Geometry; Mass spectroscopy; Parasitic capacitance; Position sensitive particle detectors; Sensor arrays; Stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
  • Conference_Location
    Interlaken, Switzerland
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5998-4
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2001.906486
  • Filename
    906486