Micromachined LCP for packaging MEMS sensors

Author

Dean, Robert ; Pack, Jeremiah ; Sanders, Nicole ; Reiner, Phil

Author_Institution

Auburn Univ., AL, USA

fYear

2005

fDate

6-10 Nov. 2005

Abstract

Liquid crystal polymer (LCP) is a thermoplastic material with a variety of useful properties that can be exploited to yield new types of packaging for MEMS sensors. Although each type of MEMS sensor has unique packaging requirements, a commercial-off-the-shelf (COTS) MEMS humidity sensor, the Hygrometrix HMX2000 was selected as a representative MEMS sensor for packaging development. The packaging process consists of patterning and Sn coating the Cu cladding on the LCP substrate, followed by micromachining the LCP substrate to realize an environmental access port for the sensor. The sensor is then attached to the LCP substrate using AuSn intermetallic bonding on a flip chip bonder.

Keywords

bonding processes; claddings; copper; electronics packaging; gold compounds; humidity sensors; liquid crystal polymers; micromachining; microsensors; tin; AuSn; Cu; Cu cladding; Hygrometrix HMX2000; LCP substrate; MEMS sensor packaging; Sn; Sn coating; commercial-off-the-shelf MEMS humidity sensor; flip chip bonder; intermetallic bonding; liquid crystal polymer; micromachining; patterning; thermoplastic material; Bonding; Coatings; Crystalline materials; Humidity; Liquid crystal polymers; Micromachining; Micromechanical devices; Packaging; Thermal sensors; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Industrial Electronics Society, 2005. IECON 2005. 31st Annual Conference of IEEE

Print_ISBN

0-7803-9252-3

Type

conf

DOI

10.1109/IECON.2005.1569273

Filename

1569273