Title :
A systematic device qualification methodology for wafer fab process technology
Author :
Rajah, Prakash ; Teck, Lim Wee
Abstract :
To transfer a manufacturing process technology from one wafer fab to another fabrication plant is a complex exercise in today´s world of semiconductor. The fabrication of a semiconductor component, depending on the product type, requires a series of diffusion, photo-etch and metallization among other processes.
Keywords :
MOS integrated circuits; etching; integrated circuit manufacture; MOSCAP product-technology transfer; manufacturing process technology; metal oxide semiconductor; metallization; photo-etch; product qualification; product type; semiconductor component; stringent electrical specifications; submicron wafer fabrication plant; systematic device qualification methodology; wafer fab process technology; wafer fabrication; Qualifications; MOSCAP; Receiving fab; Sending fab; Snakes & Bugs;
Conference_Titel :
Electronic Devices, Systems and Applications (ICEDSA), 2010 Intl Conf on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4244-6629-0
DOI :
10.1109/ICEDSA.2010.5503083
