Title :
Anodic bonding for integrated capacitive sensors
Author :
Esashi, U. ; Ura, N. ; Matsumoto, Yuki
Author_Institution :
Fac. of Eng., Tohoku Univ., Sendai, Japan
Abstract :
Anodic bonding of silicon to Pyrex glass was studied from the viewpoint of its application to integrated capacitive sensors. Equipment that was developed to allow substrate bonding in atmosphere and in vacuum is described. Vertical and lateral electrical feedthrough structures, which have excellent electrical properties and airtight performance, were developed. The vertical feedthrough structures were applied to capacitive sensors. Other bonding-related problems that were studied, such as wafer distortion, circuit damage, and metallization are noted
Keywords :
diaphragms; electric sensing devices; encapsulation; micromechanical devices; silicon; wafer bonding; Pyrex glass; Si diaphragm; airtight performance; anodic bonding; atmosphere; circuit damage; electrical feedthrough structures; encapsulation; integrated capacitive sensors; metallization; micromechanical devices; substrate bonding; vacuum; wafer distortion; Capacitive sensors; Circuits; Electrostatics; Glass; Silicon; Temperature sensors; Thermal sensors; Voltage; Wafer bonding; Wafer scale integration;
Conference_Titel :
Micro Electro Mechanical Systems, 1992, MEMS '92, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robot. IEEE
Conference_Location :
Travemunde
Print_ISBN :
0-7803-0497-7
DOI :
10.1109/MEMSYS.1992.187688
