DocumentCode :
2925691
Title :
A novel thermal optimization flow using incremental floorplanning for 3D ICs
Author :
Li, Xin ; Ma, Yuchun ; Hong, Xianlong
Author_Institution :
Dept. of Comput. Sci.&Technol., Tsinghua Univ., Beijing
fYear :
2009
fDate :
19-22 Jan. 2009
Firstpage :
347
Lastpage :
352
Abstract :
Thermal issue is a critical challenge in 3D IC design. To eliminate hotspots, physical layouts are always adjusted by shifting or duplicating hot blocks. However, these modifications may degrade the packing area as well as interconnect distribution greatly. In this paper, we propose some novel thermal-aware incremental changes to optimize these multiple objectives including thermal issue in 3D ICs. Furthermore, to avoid random incremental modification, which may be inefficient and need long runtime to converge, here potential gain is modeled for each candidate incremental change. Based on the potential gain, a novel thermal optimization flow to intelligently choose the best incremental operation is presented. We distinguish the thermal-aware incremental changes in three different categories: migrating computation, growing unit and moving hotspot. Mixed integer linear programming (MILP) models are devised according to these different incremental changes. Experimental results show that migrating computation, growing unit and moving hotspot can reduce max on-chip temperature by 7%, 13% and 15% respectively on MCNC/GSRC benchmarks. Still, experimental results also show that the thermal optimization flow can reduce max on-chip temperature by 14% compared to an existing 3D floorplan tool CBA, and achieve better area and total wirelength improvement than individual operations do.
Keywords :
integer programming; integrated circuit interconnections; integrated circuit layout; linear programming; 3S IC design; incremental floorplanning; interconnect distribution; mixed integer linear programming; onchip temperature; thermal optimization flow; thermal-aware incremental changes; wirelength improvement; Computer science; Constraint optimization; Delay; Design optimization; Runtime; Temperature; Thermal conductivity; Thermal degradation; Thermal management; Three-dimensional integrated circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2009. ASP-DAC 2009. Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-1-4244-2748-2
Electronic_ISBN :
978-1-4244-2749-9
Type :
conf
DOI :
10.1109/ASPDAC.2009.4796505
Filename :
4796505
Link To Document :
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