Title :
22 nm technology compatible fully functional 0.1 μm2 6T-SRAM cell
Author :
Haran, B.S. ; Kumar, A. ; Adam, L. ; Chang, J. ; Basker, V. ; Kanakasabapathy, S. ; Horak, D. ; Fan, S. ; Chen, J. ; Faltermeier, J. ; Seo, S. ; Burkhardt, M. ; Burns, S. ; Halle, S. ; Holmes, S. ; Johnson, R. ; Mclellan, E. ; Levin, T.M. ; Zhu, Y. ; Kuss
Author_Institution :
Albany Nano Tech, IBM Res., Albany, NY
Abstract :
We demonstrate 22 nm node technology compatible, fully functional 0.1 mum2 6T-SRAM cell using high-NA immersion lithography and state-of-the-art 300 mm tooling. The cell exhibits a static noise margin (SNM) of 220 mV at Vdd=0.9 V. We also present a 0.09 mum2 cell with SNM of 160 mV at Vdd=0.9 V demonstrating the scalability of the design with the same layout. This is the world´s smallest 6T-SRAM cell. Key enablers include band edge high-kappa metal gate stacks, transistors with 25 nm gate lengths, thin spacers, novel co-implants, advanced activation techniques, extremely thin silicide, and damascene copper contacts.
Keywords :
SRAM chips; immersion lithography; 6T-SRAM cell; damascene copper contacts; high-kappa metal gate stacks; immersion lithography; size 22 nm; size 25 nm; size 300 mm; static noise margin; voltage 0.9 V; Annealing; Copper; Fabrication; Lithography; Nanoscale devices; Random access memory; Scalability; Semiconductor device noise; Sparks; Very large scale integration;
Conference_Titel :
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2377-4
Electronic_ISBN :
8164-2284
DOI :
10.1109/IEDM.2008.4796769