• DocumentCode
    293139
  • Title

    Unification of speed, power, area, and reliability in CMOS tapered buffer design

  • Author

    Cherkauer, Brian S. ; Friedman, Eby G.

  • Author_Institution
    Dept. of Electr. Eng., Rochester Univ., NY, USA
  • Volume
    4
  • fYear
    1994
  • fDate
    30 May-2 Jun 1994
  • Firstpage
    111
  • Abstract
    Circuit speed, power dissipation, physical area, and system reliability are the four performance criteria of concern in tapered buffer design. Each places a separate, often conflicting constraint on the design of a tapered buffer. Enhanced short-channel tapered buffer design equations are developed for propagation delay and power dissipation, as well as a new split-capacitor model of hot-carrier reliability and a two-component physical area model. Each performance criterion is independently investigated and analyzed, and the interaction of the four criteria is examined to develop both a qualitative and a quantitative understanding of the various design tradeoffs. These disparate approaches to tapered buffer design are unified into a convenient, integrated design methodology
  • Keywords
    CMOS logic circuits; buffer circuits; delays; hot carriers; integrated circuit design; integrated circuit reliability; CMOS tapered buffer; buffer design equations; circuit speed; design tradeoffs; hot-carrier reliability; integrated design methodology; power dissipation; propagation delay; split-capacitor model; system reliability; two-component physical area model; Capacitance; Circuits; Design methodology; Equations; Hot carriers; Power dissipation; Power system modeling; Power system reliability; Propagation delay; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1994. ISCAS '94., 1994 IEEE International Symposium on
  • Conference_Location
    London
  • Print_ISBN
    0-7803-1915-X
  • Type

    conf

  • DOI
    10.1109/ISCAS.1994.409210
  • Filename
    409210