Millimeter-wave packaging

Author

Kuno, H.J. ; Midford, T.A.

Author_Institution

Hughes Aircraft Co., Torrance, CA, USA

fYear

1992

fDate

1-5 June 1992

Firstpage

1507

Abstract

The authors reviewed the state of the art in millimeter-wave packaging and analyzed its potentials and limitations. Based on the analysis of the requirements and technology development, the following trends can be expected for millimeter-wave packages: (1) packaging at higher levels of integration-the advent of millimeter-wave multichip packages; (2) the substantially increased use of electromagnetic simulation design tools; (3) the introduction of new materials and processes, for example AlN and cofired ceramic techniques; (4) the integration of a considerably higher complexity and multiplicity of electronic functions within the package envelope; and (5) a substantial reduction in the size, weight, and cost of millimeter-wave packages.<>

Keywords

MMIC; integrated circuit technology; microwave devices; microwave integrated circuits; multichip modules; packaging; AlN; MM-wave type; cofired ceramic; electromagnetic simulation design tools; millimeter-wave packages; multichip packages; Aircraft; Degradation; Electronics packaging; Heat sinks; Integrated circuit packaging; Millimeter wave integrated circuits; Millimeter wave technology; Packaging machines; Phased arrays; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1992., IEEE MTT-S International

Conference_Location

Albuquerque, NM, USA

ISSN

0149-645X

Print_ISBN

0-7803-0611-2

Type

conf

DOI

10.1109/MWSYM.1992.188299

Filename

188299