Title :
Versatility and manufacturability considerations for a new 3-watt X-band power MMIC
Author :
Raicu, D. ; Kraemer, B.M. ; Day, D.S. ; Basset, J.R. ; Wei, J. ; Hua, C. ; Chung, Y. ; Chang, C.S.
Author_Institution :
Avantek Inc., Santa Clara, CA, USA
Abstract :
The authors present a two-stage power amplifying monolithic microwave integrated circuit (MMIC) capable of delivering 3 W at X-band with high efficiency. This MMIC was designed for operation with external matching circuits on separate ceramic substrates. By customizing these circuits, the same MMIC can cover an entire array of different applications. The versatility of this approach was demonstrated by the implementation of this MMIC in four power modules specified for different bandwidths, power levels and bias voltages. The small chip size and the tunability allowed by the external circuits resulted in increased manufacturing yields and made possible significant cost reductions.<>
Keywords :
MMIC; integrated circuit manufacture; microwave amplifiers; power amplifiers; power integrated circuits; 3 W; 7 to 11 GHz; X-band power MMIC; ceramic substrates; chip size; cost reductions; external matching circuits; manufacturability; manufacturing yields; power modules; tunability; two stage power amplifier; Costs; Driver circuits; FETs; Fingers; Frequency; Impedance; MMICs; Manufacturing; Power generation; Voltage;
Conference_Titel :
Microwave Symposium Digest, 1992., IEEE MTT-S International
Conference_Location :
Albuquerque, NM, USA
Print_ISBN :
0-7803-0611-2
DOI :
10.1109/MWSYM.1992.188333