Title :
Manufacturing and packaging of optoelectronic components
Author :
Weissman, Robert H.
Author_Institution :
Opt. Commun. Div., Hewlett-Packard Co., San Jose, CA, USA
fDate :
25 Feb.-1 March 1996
Abstract :
Summary form only given. Wide-scale system deployment of optoelectronic components requires continuing reductions in product selling price. Particularly price-sensitive applications include computer local area networks and fiber-to-the-curb interconnects. To satisfy market needs a successful manufacturer must have a highly flexible, efficient, and robust production capability. This paper reviews how device technologies, assembly techniques, packaging materials, and designs are evolving to meet this challenge without sacrificing component quality and reliability.
Keywords :
distributed feedback lasers; integrated circuit manufacture; integrated circuit packaging; integrated optoelectronics; light emitting diodes; optical communication equipment; semiconductor lasers; assembly techniques; component quality; component reliability; computer local area networks; fiber-to-the-curb interconnects; optoelectronic component manufacture; optoelectronic component packaging; packaging materials; price-sensitive applications; product selling price; robust production capability; Application software; Computer applications; Computer networks; Flexible manufacturing systems; LAN interconnection; Local area networks; Optical fiber LAN; Optical fiber devices; Packaging; Robustness;
Conference_Titel :
Optical Fiber Communications, 1996. OFC '96
Print_ISBN :
1-55752-422-X
DOI :
10.1109/OFC.1996.907634
