DocumentCode
2932906
Title
Conformal doping for FinFETs and precise controllable shallow doping for planar FET manufacturing by a novel B2 H6 /Helium Self-Regulatory Plasma Doping process
Author
Sasaki, Y. ; Okashita, K. ; Nakamoto, K. ; Kitaoka, T. ; Mizuno, B. ; Ogura, M.
Author_Institution
Ultimate Junction Technol. Inc., Moriguchi
fYear
2008
fDate
15-17 Dec. 2008
Firstpage
1
Lastpage
4
Abstract
A new self-regulatory plasma doping (SRPD) technique with B2H6/helium gas plasma has been successfully developed that provide conformal doping for fins and precise controllable ultra-shallow doping for planar FET. Manufacturing level of process controllability (<1% on dose) of the new SRPD has been realized, and advantage of the SRPD has been verified with FinFETs with metal/high-k gate stack and planar pMOSFETs for the first time. Short channel effect (SCE) improvement for FinFETs is clearly obtained. Dramatically Ion enhancement (+14% Ion at the Ioff of 10-8 A/um vs. ion implant ref.) with SCE suppression for planar pMOSFETs is also realized. This new SRPD will be the excellent compatible doping method for pMOS FinFETs as well as planar pMOSFETs extension for 32nm node and beyond.
Keywords
MOSFET; plasma materials processing; semiconductor doping; conformal doping; helium gas plasma; metal-high-k gate stack; pMOS FinFET; planar pMOSFET; precise controllable ultrashallow doping; self-regulatory plasma doping process; short channel effect improvement; size 32 nm; Controllability; Doping; FETs; FinFETs; Helium; High K dielectric materials; High-K gate dielectrics; MOSFETs; Manufacturing processes; Plasma materials processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location
San Francisco, CA
ISSN
8164-2284
Print_ISBN
978-1-4244-2377-4
Electronic_ISBN
8164-2284
Type
conf
DOI
10.1109/IEDM.2008.4796850
Filename
4796850
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