Title :
In system programming, the future for high density devices
Author :
Mitchell, Richard
Author_Institution :
High Density Applic., Lattice Semicond. Corp., Milpitas, CA, USA
Abstract :
In-System Programmability (ISP) is solving design challenges in many diverse applications such as very-high-density board configurations and multi-chip modules (MCMs). These applications can no longer use sockets, through-hole PGA´s, or even PLCC packages, and are rapidly moving towards fine-pin-pitch Quad Flat Packages (QFP) or no package at all. These new packaging trends address the device handling and programming issues, such as solderability and bent pin handling which designers currently face. This paper discusses ISP technology and the advantages of designing with Lattice´s ispLSI devices
Keywords :
PLD programming; fine-pitch technology; integrated circuit packaging; integrated logic circuits; logic design; multichip modules; programmable logic devices; ISP technology; Lattice; MCM; fine-pin-pitch QFP; high density devices; in-system programmability; insystem programming; ispLSI devices; multichip modules; quad flat packages; Costs; EPROM; Lattices; Logic devices; Manufacturing; Packaging; Printed circuits; Prototypes; Random access memory; Sockets;
Conference_Titel :
WESCON/94. Idea/Microelectronics. Conference Record
Conference_Location :
Anaheim , CA
Print_ISBN :
0-7803-9992-7
DOI :
10.1109/WESCON.1994.403522
