• DocumentCode
    2935995
  • Title

    The Incident Angle Effect of Al Adatom on the Growth Morphology of Al/Ni(001) System: Molecular Dynamics Simulation

  • Author

    Lee, S. ; Chung, Y.

  • Author_Institution
    Hanyang Univ., Seoul
  • fYear
    2006
  • fDate
    8-12 May 2006
  • Firstpage
    167
  • Lastpage
    167
  • Abstract
    The deposition behavior of Al atoms on Ni(001) substrate for various adatom incident angle and incident energy is investigated in this study using molecular dynamics simulation to investigate the growth morphology and the quality of thin film in atomic level. Results show that the surface roughness is comparatively decreased irrespective of adatom incident angle at the incident energy of 6 eV.
  • Keywords
    aluminium; atomic layer deposition; metallic thin films; molecular dynamics method; surface roughness; Al; Ni; adatom incident angle; adatom incident energy; atomic level; growth morphology; molecular dynamics simulation; surface roughness; thin film; Acceleration; Atomic layer deposition; Atomic measurements; Ceramics; Power engineering and energy; Rough surfaces; Sputtering; Substrates; Surface morphology; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference, 2006. INTERMAG 2006. IEEE International
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    1-4244-1479-2
  • Type

    conf

  • DOI
    10.1109/INTMAG.2006.375667
  • Filename
    4261601