Title :
Challenges of flip chip on organic substrate assembly technology
Author :
Nagesh, V.K. ; Peddada, R. ; Ramalingam, S. ; Sur, B. ; Tai, A.
Author_Institution :
Assembly Technol. Dev., Intel Corp., Santa Clara, CA, USA
Abstract :
Flip chip assembly on organic substrate technology has been developed and implemented as a key packaging technology for Intel´s microprocessors for cost and performance advantages. In this paper, the process flow, key technology challenges and accomplishments achieved will be addressed. The paper discusses the challenges faced, and their resolution during the development of this key technology that is implemented in high volume manufacturing at Intel
Keywords :
flip-chip devices; integrated circuit packaging; microprocessor chips; Intel microprocessor; flip-chip assembly; high volume manufacturing; organic substrate; packaging technology; process flow; Assembly; Costs; Flip chip; Manufacturing processes; Packaging; Silicon; Space technology; Temperature; Testing; Throughput;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776304
