DocumentCode
2937591
Title
Tagging module for lesion localization in capsule endoscopy
Author
Chandrappan, Jayakrishnan ; Ruiqi, Lim ; Su, Nandar ; Qiang, Tanq Shao ; Vaidyanathan, Kripesh
Author_Institution
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
fYear
2010
fDate
Aug. 31 2010-Sept. 4 2010
Firstpage
1890
Lastpage
1893
Abstract
Capsule endoscopes are effective diagnostic tools for the gastro intestinal tract disorders at patient´s comfort. However the present capsule endoscopes lack efficient localization techniques to specify a pathological area that may require further diagnosis or treatment. This paper presents the development of a tagging module based novel method for the real-time localization of the site of interest. The tagging module consists of a bio compatible micro tag, compressed spring with a string latch and thermal igniter. The module can be integrated with the capsule endoscope and activated using an external trigger signal. On activation, the micro tag releases instantly and penetrates the mucosa layer of GI tract, region of interest. X-ray imaging is used to detect the location of micro tag embedded in GI tract wall. The radiopaque micro tags provide pre-operative valuable position information of the infected area to facilitate further clinical procedures.
Keywords
diagnostic radiography; endoscopes; medical disorders; X-ray imaging; biocompatible micro tag; capsule endoscopes; capsule endoscopy; compressed spring; gastrointestinal tract disorders; lesion localization; localization techniques; mucosa layer; pathological area; radiopaque micro tags; string latch; tagging module; thermal igniter; Endoscopes; Heating; Intestines; Springs; Tagging; Titanium; X-ray imaging; Animals; Barium; Biocompatible Materials; Capsule Endoscopes; Capsule Endoscopy; Endoscopes; Endoscopy; Equipment Design; Humans; Intestines; Silicon; Swine; Titanium; X-Rays;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location
Buenos Aires
ISSN
1557-170X
Print_ISBN
978-1-4244-4123-5
Type
conf
DOI
10.1109/IEMBS.2010.5627090
Filename
5627090
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