DocumentCode :
2937726
Title :
Multilayer printing of embroidered RF circuits on polymer composites
Author :
Wang, Zheyu ; Zhang, Lanlin ; Bayram, Yakup ; Volakis, John L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Ohio State Univ., Columbus, OH, USA
fYear :
2011
fDate :
3-8 July 2011
Firstpage :
278
Lastpage :
281
Abstract :
This paper presents embroidered conductive fibers (E-fiber) on polymer composites for conformal and light-weight RF circuits and antennas. A polydimethylsiloxane, namely PDMS, is adapted. Our earlier studies showed that it had a remarkable RF performance with a tangent loss of less 0.02 at RF frequencies. In this paper, an embroidered E-fiber microstrip line sample was fabricated with conductive fibers on a polymer substrate, and its RF characteristics were measured. The S-parameters were compared with those of copper microstrip lines. Measurements indicated that the insertion loss of the E-fiber microstrip line was only 0.04dB/cm higher than that of the copper. A multilayer microstrip line using similar fabrication techniques was also printed and measurements were conducted. All results clearly demonstrate the feasibility of the proposed embroidered conductive fiber technique for flexible and conformal RF applications.
Keywords :
S-parameters; antennas; conducting polymers; microstrip lines; radiofrequency integrated circuits; RF frequency; RF performance; S-parameter; antenna; conformal RF circuit; copper microstrip line; embroidered RF circuit; embroidered conductive fiber; embroidered e-fiber microstrip line; insertion loss; light-weight RF circuit; multilayer microstrip line; multilayer printing; polydimethylsiloxane; polymer composite; polymer substrate; tangent loss; Copper; Microstrip; Polymers; Printing; Radio frequency; Substrates; Transmission line measurements; E-fiber circuits; conformal and flexible; multilayer printing; polymer composite;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
Conference_Location :
Spokane, WA
ISSN :
1522-3965
Print_ISBN :
978-1-4244-9562-7
Type :
conf
DOI :
10.1109/APS.2011.5996696
Filename :
5996696
Link To Document :
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